https://doi.org/10.1051/epjconf/20100642019
Copper-Rubber Interface Delamination in Stretchable Electronics
1
Eindhoven University of Technology, Section Mechanics of
Materials, P.O. Box
513, NL
5600
MB, The
Netherlands
2
Philips Applied Technologies, System in Package,High Tech
Campus 7, 5656
AE Eindhoven,
The Netherlands
a e-mail: j.neggers@tue.nl
This article has no abstract.
© Owned by the authors, published by EDP Sciences, 2010