https://doi.org/10.1051/epjconf/20134501046
Use of LHP for cooling power electronic components
University of Žilina, Departure of Power Engineering, Univerzitna 1, 010 26 Žilina, Slovakia
a e-mail: martin.smitka@fstroj.uniza.sk
The paper deals with use of cooling equipment build on basis two phase thermosyphon loop. This device belongs to a group of loop heat pipe (LHP). This LHP is a two-phase device with extremely high effective thermal conductivity that utilizes the thermodynamic pressure difference to circulate fluid. It was invented in Russia in the early 1980´s. Thermosyphon loop is similar as LHP but it doesn’t contain wick and circulation of the fluid using gravitation force instead of capillary pressure as it is in LHP. The work deals with the cooling insulated gate bipolar transistor with 370 W. The paper describes the course of the heat dissipation using ribbed cooler for natural convection and using fin for forced convection. The results are compared with heat dissipation through thermosyphon loop.
© Owned by the authors, published by EDP Sciences, 2013
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 2.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
