https://doi.org/10.1051/epjconf/201818002073
Influence of the ambient temperature on the cooling efficiency of the high performance cooling device with thermosiphon effect
University of Zilina, Faculty of Mechanical Engineering, Department of Power Engineering, Univerzitna 8215/1, 010 26 Zilina, Slovak republic
* Corresponding author: patrik. nemec@fstroj.uniza.sk
Published online: 4 June 2018
This work deal with experimental measurement and calculation cooling efficiency of the cooling device working with a heat pipe technology. The referred device in the article is cooling device capable transfer high heat fluxes from electric elements to the surrounding. The work contain description, working principle and construction of cooling device. The main factor affected the dissipation of high heat flux from electronic elements through the cooling device to the surrounding is condenser construction, its capacity and option of heat removal. Experimental part describe the measuring method cooling efficiency of the cooling device depending on ambient temperature in range -20 to 40°C and at heat load of electronic components 750 W. Measured results are compared with results calculation based on physical phenomena of boiling, condensation and natural convection heat transfer.
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (http://creativecommons.org/licenses/by/4.0/).
