https://doi.org/10.1051/epjconf/201919600053
The changing of silicon suboxide film thickness as a result of high temperature annealing
1 Kutateladze Institute of Thermophysics SB RAS, 630090, Ac. Lavrentiev ave. 1, Novosibirsk, Russia
2 Novosibirsk State University, 630090, Pirogova str. 2, Novosibirsk, Russia
* Corresponding author: zamchiy@gmail.com
Published online: 14 January 2019
The a-SiOx:H thin films were deposited by the gas-jet electron beam plasma chemical vapor deposition method with different stoichiometry (x=0.15-1.0) for different SiH4 flow rates. The concentration of hydrogen in the films increases with the growth rate in ranges from 1.5 to 4.8 at.%. Further annealing leads to the effusion of hydrogen from the structure of the material and the compression of the structure, which leads to a reduction in the thickness for all films. X-ray diffraction measurements showed that the as-deposited films crystallized to form nc-Si about 4-8 nm in size after annealing at 1000°C.
© The Authors, published by EDP Sciences, 2019
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