https://doi.org/10.1051/epjconf/202328701014
Heterogeneous interconnection of low-loss and dense material platforms using adiabatic tapering coupler
Department of Imaging Physics (ImPhys), Faculty of Applied Sciences, Delft University of Technology, Delft 2628CJ, The Netherlands
* Corresponding author: I.EsmaeilZadeh@tudelft.nl
Published online: 18 October 2023
Recently, we successfully realized amorphous silicon carbide (a-SiC) integrated photonics with optical losses as low as 0.78 dB/cm. Moreover, the deposition of a-SiC was done at 150 ℃, which enables successful lift of a-SiC as an additive step to existing photonics circuits. In this work, we present an adiabatic taper coupler which provides bidirectional lossless connection between two integrated photonics platforms: thin-film silicon nitride (Si3N4) and a-SiC. Normalized power transmission of 96.61% is presented, and the coupler enables strong confinement when coupling from weakly confined thin-film device to normal thickness device. By utilizing such a coupler as bridge, switching back and forth between Si3N4 and a-SiC platforms can be easily realized. This allow us to carry out applications including quantum interference and digital Fourier spectroscopy, in which long optical delay lines are constructed on Si3N4 and highly integrated circuits are built on a-SiC.
© The Authors, published by EDP Sciences, 2023
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
