https://doi.org/10.1051/epjconf/202430903026
Twyman effect in laser polishing of fused silica wafers
OST Eastern Switzerland University of Applied Sciences, Institute for Microtechnology and Photonics, 9471 Buchs, Switzerland
* Corresponding author: sven.laemmler@ost.chs
Published online: 31 October 2024
This paper investigates the challenges of minimizing wafer deformation during laser polishing of fused silica. The focus is on the Twyman effect, which causes unwanted curvature in thin plates. Strategies to reduce stress-induced deformation are proposed to enhance the reproducibility of the laser polishing process.
© The Authors, published by EDP Sciences, 2024
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
