https://doi.org/10.1051/epjconf/201818303023
Analysis of Dynamic Plastic Deformation process on an Electrolytic Tough - Pitch copper (Cu-ETP): From material characterization to models improvement
1
THIOT INGENIERIE, Route Nationale,
46130
Puybrun,
France
2
LSPM, CNRS - UPR3407,
99 av. Jean Baptiste Clément – 93430
Villetaneuse
3
NEXTER MUNITIONS, DT/MLA,
7 Route de Guerry,
18023
Bourges Cedex
* Corresponding author: mespoulet@thiot-ingenierie.com
Published online: 7 September 2018
This paper presents a comprehensive study of a direct impact compression loading on an Electrolytic Tough-Pitch copper (Cu-ETP). The aim of the study is to provide reliable experimental data in this dynamic loading using high-speed video camera records and real time projectile deceleration profiles. Test set-up has been optimized to ensure an efficient recovery of the samples after the Dynamic Plastic Deformation (DPD) process in the 103 to 104 s-1 strain rate range regime. Structural investigations have been made on post-mortem samples: microstructure investigations of recovered samples have shown more structural changes in terms of crystallographic texture and grain sizes. Post-mortem tensile tests have also been carried out to evaluate yield strength behavior of the Cu-ETP copper after the DPD process. Numerical simulations have been performed to evaluate the ability of empirical models to reproduce recorded signals. In-situ results (time evolution of strain, strain rate, temperature, etc.) given by the numerical analysis have contributed to enrich the post-mortem analysis.
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
