Proceedings

EPJ B Colloquium - Hierarchically nanostructured thermoelectric materials: challenges and opportunities for improved power factors

Schematic of a hierarchically nanostructured thermoelectric material consisting of a matrix material with embedded atomic defects, nanoinclusions (NIs), and grain boundaries. Phonons scatter of the defects. Such geometry also provides possibilities for power factor improvements.

The field of thermoelectric materials has undergone a revolutionary transformation over the last couple of decades as a result of the ability to nanostructure and synthesize myriads of materials and their alloys. The ZT figure of merit, which quantifies the performance of a thermoelectric material has more than doubled after decades of inactivity, reaching values larger than two, consistently across materials and temperatures. Central to this, is the drastic reduction in the materials’ thermal conductivity due to the hierarchical scattering of phonons on the purposely included numerous interfaces, boundaries, dislocations, point defects, phases, etc. However, as the thermal conductivity has reached amorphous values, these benefits are reaching their limits. Any further benefits would come from the power factor, namely the product of the electronic conductivity and Seebeck coefficient squared. These quantities need to be maximized, however, they are in general inversely related, which makes power factor improvement a significant challenge.

In a new Colloquium published in EPJ B, an international author team review recent efforts undertaken in the same ultra-low thermal conductivity nanostructured materials, but now focusing on power factor improvements. They then explore how to design and optimize nanostructured materials in order to relax the adverse interdependence of the electrical conductivity and Seebeck coefficient. For this, elegant designs are presented, reached through advanced simulations and partially backed by experiments, which identifies the essential design ‘ingredients’ for exceptionally high thermoelectric power factors. The combination of the existing methods for ultra-low thermal conductivities and the presented methods for ultra-high power factors, could provide the leap forward for thermoelectric materials.

This was our first experience of publishing with EPJ Web of Conferences. We contacted the publisher in the middle of September, just one month prior to the Conference, but everything went through smoothly. We have had published MNPS Proceedings with different publishers in the past, and would like to tell that the EPJ Web of Conferences team was probably the best, very quick, helpful and interactive. Typically, we were getting responses from EPJ Web of Conferences team within less than an hour and have had help at every production stage.
We are very thankful to Solange Guenot, Web of Conferences Publishing Editor, and Isabelle Houlbert, Web of Conferences Production Editor, for their support. These ladies are top-level professionals, who made a great contribution to the success of this issue. We are fully satisfied with the publication of the Conference Proceedings and are looking forward to further cooperation. The publication was very fast, easy and of high quality. My colleagues and I strongly recommend EPJ Web of Conferences to anyone, who is interested in quick high-quality publication of conference proceedings.

On behalf of the Organizing and Program Committees and Editorial Team of MNPS-2019, Dr. Alexey B. Nadykto, Moscow State Technological University “STANKIN”, Moscow, Russia. EPJ Web of Conferences vol. 224 (2019)

ISSN: 2100-014X (Electronic Edition)

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